Title:
LAMINATE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/210154
Kind Code:
A1
Abstract:
Provided is a laminate that can be implemented with a wide processing margin and without adhesive residue or damage to a semiconductor element in the transfer of the semiconductor element using laser light of various wavelengths. The laminate is obtained by laminating a substrate 1 having laser permeability, a resin film 1 and a resin film 2 in this order, wherein the light absorbance of the resin film 1 calculated for a film thickness of 1.0 μm at any wavelength of 200 nm to 1100 nm is 0.4-5.0, and the adhesive strength of the surface of the resin film 2 on the side opposite that of the resin film 1 side is 0.02-0.3 N/cm.
More Like This:
| JPH0216048 | UV STABILIZED ACRYLIC PRIMER COMPOSITION |
| JP2011183573 | COMPOSITE MOLDED OBJECT |
Inventors:
NAKAJIMA RISANO (JP)
ARIMOTO YUKARI (JP)
KOSHINO MIKA (JP)
ARAKI HITOSHI (JP)
TOMIKAWA MASAO (JP)
FUJIWARA TAKENORI (JP)
AOSHIMA KENTA (JP)
ARIMOTO YUKARI (JP)
KOSHINO MIKA (JP)
ARAKI HITOSHI (JP)
TOMIKAWA MASAO (JP)
FUJIWARA TAKENORI (JP)
AOSHIMA KENTA (JP)
Application Number:
PCT/JP2022/013453
Publication Date:
October 06, 2022
Filing Date:
March 23, 2022
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
B32B27/00; B32B7/023; C08G73/10
Domestic Patent References:
| WO2020189273A1 | 2020-09-24 | |||
| WO2020080276A1 | 2020-04-23 | |||
| WO2014050820A1 | 2014-04-03 | |||
| WO2019207920A1 | 2019-10-31 | |||
| WO2016152906A1 | 2016-09-29 | |||
| WO2016167296A1 | 2016-10-20 | |||
| WO2017170021A1 | 2017-10-05 |
Foreign References:
| JP2020149985A | 2020-09-17 | |||
| JP2014515883A | 2014-07-03 | |||
| US20200234993A1 | 2020-07-23 | |||
| US9650723B1 | 2017-05-16 | |||
| JP2017531915W | ||||
| JP2020129638A | 2020-08-27 | |||
| JP2020188037A | 2020-11-19 | |||
| JP2010251359A | 2010-11-04 | |||
| JP2014515883W | ||||
| JP3120476B2 | 2000-12-25 |
Download PDF: