Title:
LAMINATE STRUCTURE, CURED PRODUCT OF RESIN LAYER IN SAID LAMINATE STRUCTURE, ELECTRONIC COMPONENT, AND CURED PRODUCT FORMATION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/202661
Kind Code:
A1
Abstract:
[Problem] To provide: a laminate structure that provides excellent detachability and affixing ability between a resin layer and a second film even in a condition where the environmental temperature around the laminate structure increases to a certain temperature (particularly, to about 40°C); a cured product of a resin layer in said laminate structure; an electronic component having said cured product; and a method for forming said cured product. [Solution] The laminate structure sequentially includes a first film, a resin layer, and a second film. The resin layer contains (A) an alkali-soluble resin, (B) a polyfunctional photopolymerizable monomer, (C) a photoinitiator, and (D) a thermosetting resin. The detachment strength between the second film and the resin layer at an environmental temperature of 40°C is 0.4-1.5 N/cm.
Inventors:
SASAKI MASAKI (JP)
YONEDA KAZUYOSHI (JP)
YONEDA KAZUYOSHI (JP)
Application Number:
PCT/JP2022/012599
Publication Date:
September 29, 2022
Filing Date:
March 18, 2022
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
B32B27/00; G03F7/004; G03F7/027; H05K3/28
Domestic Patent References:
| WO2017122460A1 | 2017-07-20 |
Foreign References:
| JP2019144521A | 2019-08-29 | |||
| JP2017191335A | 2017-10-19 | |||
| JP2017198747A | 2017-11-02 | |||
| JP2017198746A | 2017-11-02 | |||
| JP2010232422A | 2010-10-14 |
Attorney, Agent or Firm:
ETOH Toshiaki et al. (JP)
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