RESIN COMPOSITION, COATING SOLUTION, FILM, AND MULTILAYER STRUCTURE

Title:

RESIN COMPOSITION, COATING SOLUTION, FILM, AND MULTILAYER STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2022/202660

Kind Code:

A1

Abstract:

This resin composition has, in particular, excellent oxygen barrier properties under high humidity, and therefore provides a packaging material and a resin composition that has excellent gas barrier properties, particularly oxygen barrier properties, under high humidity.　A resin composition including a hydrophilic resin and a metal compound, the resin composition being characterized in that the mass ratio of the content of the hydrophilic resin and the content in terms of the metal of the metal compound (content of the hydrophilic resin : content in terms of the metal of the metal compound) is 90:10 to 20:80.

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Inventors:

KOBAYASHI RYOHEI (JP)
KANAMORI YUYA (JP)

Application Number:

PCT/JP2022/012589

Publication Date:

September 29, 2022

Filing Date:

March 18, 2022

Export Citation:

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Assignee:

MITSUBISHI CHEM CORP (JP)

International Classes:

B32B27/30; C08J5/18; C08K5/098; C08L5/00; C08L29/04; C08L101/00; C09D105/00; C09D129/04

Domestic Patent References:

WO2009084191A1	2009-07-09
WO2020203902A1	2020-10-08

Foreign References:

JP2012528255A	2012-11-12
JP2018089567A	2018-06-14
JP2002338821A	2002-11-27

Other References:

INORG. CHEM., vol. 52, 2013, pages 95 - 102

Attorney, Agent or Firm:

SAITOH Yukihiko et al. (JP)

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