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Title:
LAMINATED FILM AND METHOD FOR PRODUCING LAMINATED FILM
Document Type and Number:
WIPO Patent Application WO/2024/019039
Kind Code:
A1
Abstract:
[Problem] To provide a laminated film capable of providing a resin sheet combining high smoothness with satisfactory slipperiness. [Solution] A laminated film comprising a polyester-based base film, a release layer disposed on at least one surface of the base film, and a resin sheet disposed on the surface of the release layer on the reverse side from the base, the laminated film satisfying the following: the resin sheet is one obtained by curing a resin-sheet-forming composition comprising at least a resin component (A) and a crosslinking agent (B); the resin sheet contains substantially no particles; the resin sheet has a film thickness (t1) of 1-20 μm; the resin sheet has a surface (1) having an arithmetic average height (Sa) of 2-30 nm; the release-layer-side surface (2) of the resin sheet, when examined after the resin sheet has been removed from the laminated film, has a surface free energy of 45 mJ/m2 or less; and the coefficient of static friction between the surface (1) on the reverse side of the resin sheet from the release layer surface and the release-layer-side surface (2) of the resin sheet is 1.5 or less.

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Inventors:
AMANO YUKA (JP)
NAKATANI MITSUHARU (JP)
ONO YUJI (JP)
KUBO TAKESHI (JP)
Application Number:
PCT/JP2023/026229
Publication Date:
January 25, 2024
Filing Date:
July 18, 2023
Export Citation:
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Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/26; B32B7/06; B32B27/36; C08J7/04
Domestic Patent References:
WO2022163569A12022-08-04
WO2022186184A12022-09-09
WO2021005823A12021-01-14
Foreign References:
JP2022025703A2022-02-10
JP2012229399A2012-11-22
JP2009013384A2009-01-22
JP2023111662A2023-08-10
JP2023111664A2023-08-10
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