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Title:
LAMINATED FILM AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2018/135544
Kind Code:
A1
Abstract:
The present invention provides a laminated film with which it is possible to suitably heat weld together two or more members. This laminated film is used for bonding a first member and a second member, and is at least provided with a first heat-weldable resin layer, a heat-resistant intermediate layer, and a second heat-weldable resin layer, sequentially in this order.

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Inventors:
FUJIWARA RYO (JP)
TAKAHAGI ATSUKO (JP)
Application Number:
PCT/JP2018/001268
Publication Date:
July 26, 2018
Filing Date:
January 17, 2018
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
C09J7/20; B29C65/40; B32B27/00; C09J11/00; C09J123/26; C09J201/00
Domestic Patent References:
WO2014097964A12014-06-26
WO2012090646A12012-07-05
Foreign References:
JP2009084442A2009-04-23
JP2011074230A2011-04-14
JP2013091268A2013-05-16
JP2007254719A2007-10-04
JP2011208041A2011-10-20
JPS56145965A1981-11-13
JP2008030227A2008-02-14
JPH10329259A1998-12-15
Attorney, Agent or Firm:
TANAKA, Junya et al. (JP)
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