Title:
LAMINATED SUBSTRATE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2014/030471
Kind Code:
A1
Abstract:
Provided is a laminated substrate such that cracking due to shear stress between a blade and ceramic material during a punching process for forming end-face electrodes or due to stress attributable to a difference in linear expansion coefficient between the end-face electrodes and the ceramic material is prevented. No end-face electrode is formed on a non-magnetic ferrite layer (11) and a non-magnetic ferrite layer (15) on the outermost layers. Mounting electrodes formed on the outermost layers are electrically connected to as far as the internal wiring at a boundary surface between a magnetic ferrite layer (12) and a magnetic ferrite layer (14) by means of via holes provided inside the non-magnetic ferrite layer (11) and non-magnetic ferrite layer (15) on the outermost layers, and are then connected to the end-face electrodes through the internal wiring. Consequently, only the outermost non-magnetic ferrite layers are connected by means of the via holes, and the magnetic ferrite layers are connected through the end-face electrodes instead of the via holes.
Inventors:
IEDA AKIHIRO (JP)
OTSUBO YOSHIHITO (JP)
OTSUBO YOSHIHITO (JP)
Application Number:
PCT/JP2013/069586
Publication Date:
February 27, 2014
Filing Date:
July 19, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/46; H05K1/11
Foreign References:
| JP2012089818A | 2012-05-10 | |||
| JP2005044886A | 2005-02-17 |
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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