Title:
LASER CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/034462
Kind Code:
A1
Abstract:
This laser cutting method comprises a first step for forming, at multiple locations in the outer perimeter of a component (10), a first slit (S1) by cutting, with a laser beam, a metal plate (W) from a first point, which is separated outward from an edge (10e) of the component (10) by a first distance, up to a second point, which is separated outward from the edge (10e) of the component (10) by a second distance shorter than the first distance and which is separated in a direction along the edge (10e) by a third distance. The laser cutting method also comprises a second step for forming a second slit by cutting, with a laser beam, the metal plate (W) from the second point toward the edge (10e) in such a manner as to reach a cut-groove formation region where a cut groove (S10) is to be formed when cutting the outer perimeter. The laser cutting method further comprises a third step for cutting, with a laser beam, the metal plate (W) along the edge (10e) so as to form the cut groove (S10) in the cut-groove formation region.
Inventors:
TAKANO HIROSHI (JP)
NOMURA TAKUMI (JP)
ITO SONOKA (JP)
NOMURA TAKUMI (JP)
ITO SONOKA (JP)
Application Number:
PCT/JP2023/028097
Publication Date:
February 15, 2024
Filing Date:
August 01, 2023
Export Citation:
Assignee:
AMADA CO LTD (JP)
International Classes:
B23K26/08; B23K26/38
Domestic Patent References:
| WO2020059533A1 | 2020-03-26 |
Foreign References:
| JP2020069482A | 2020-05-07 | |||
| JPS6358506A | 1988-03-14 | |||
| JP2016068144A | 2016-05-09 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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