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Title:
LASER DOPING DEVICE AND LASER DOPING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/151723
Kind Code:
A1
Abstract:
This laser doping device, which performs doping by irradiating a predetermined region of a semiconductor material with a pulsed laser beam, may be provided with: a solution supply system that supplies the predetermined region with a dopant-containing solution; and a laser system that includes at least one laser device that outputs a pulsed laser beam that passes through the dopant-containing solution, and a pulse time waveform adjustment device that adjusts the pulse time waveform of the pulsed laser beam.

Inventors:
OHKUBO TOMOYUKI (JP)
IKENOUE HIROSHI (JP)
IKEDA AKIHIRO (JP)
ASANO TANEMASA (JP)
WAKABAYASHI OSAMU (JP)
Application Number:
PCT/JP2015/058709
Publication Date:
September 29, 2016
Filing Date:
March 23, 2015
Export Citation:
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Assignee:
UNIV KYUSHU (JP)
GIGAPHOTON INC (JP)
International Classes:
H01L21/265; H01L21/22
Domestic Patent References:
WO2014156818A12014-10-02
Foreign References:
JP2010525554A2010-07-22
JP2007123300A2007-05-17
JP4387091B22009-12-16
Other References:
KOJI NISHI ET AL.: "Phosphorus Doping into 4H- SiC by Irradiation of Excimer Laser in Phosphoric Solution", JAPANESE JOURNAL OF APPLIED PHYSICS, vol. 52, no. 6, 20 June 2013 (2013-06-20), pages 06GF02 - 1-4, XP055244767
DAICHI MARUI ET AL.: "Aluminum Doping of 4H-SiC by Irradiation of Excimer Laser in Aluminum Chloride Solution", JAPANESE JOURNAL OF APPLIED PHYSICS, vol. 53, 21 May 2014 (2014-05-21), pages 06JF03 - 1-4, XP001590312
Attorney, Agent or Firm:
HOSAKA Nobuhisa (JP)
Hosaka Prolongation of life (JP)
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