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Patent Searching and Data


Title:
LASER MACHINING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/020576
Kind Code:
A1
Abstract:
A laser machining device (100), comprising: a housing (10); a guide optical axis (20), wherein the guide optical axis (20) is provided on the housing (10) and extends in a first direction; and a machining apparatus (30), wherein the machining apparatus (30) comprises a laser housing (31) and a laser (32), the laser (32) is connected to the laser housing (31), the laser housing (31) is slidably connected to the guide optical axis (20), the laser (32) moves along with the laser housing (31) relative to the housing (10) in the first direction or a second direction, and the first direction and the second direction are opposite. The laser machining device guides the movement of the laser connected to the laser housing relative to the housing, thereby improving the smoothness and accuracy of the movement of the laser relative to the housing, improving the movement accuracy of the laser during the machining of a workpiece after the laser moves by an appropriate distance towards the workpiece, and improving the machining accuracy of the laser machining device.

Inventors:
SHEN CHANGRONG (CN)
WANG WENHUA (CN)
LIU ZHEN (CN)
ZOU WEIHUA (CN)
ZHANG YOUTIAN (CN)
YIN JUN (CN)
ZHANG YUANXIU (CN)
DONG JUNHUA (CN)
FAN FEI (CN)
LIU WEN (CN)
CHI KUNRONG (CN)
XIN LIJIAO (CN)
Application Number:
PCT/CN2022/113308
Publication Date:
February 23, 2023
Filing Date:
August 18, 2022
Export Citation:
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Assignee:
MAKEBLOCK CO LTD (CN)
International Classes:
B23K26/362; H01S3/0941
Foreign References:
CN206536129U2017-10-03
CN208929456U2019-06-04
CN113352006A2021-09-07
JP2004240205A2004-08-26
US6539044B12003-03-25
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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