Title:
LASER MACHINING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/180774
Kind Code:
A1
Abstract:
Provided is a laser machining method comprising: a preparation procedure for preparing a machining object having a corner at which a first region, which expands along a predetermined surface, and a second region, which expands along a surface intersecting the surface formed by the first region, are formed adjacent to each other; an irradiation procedure for irradiating the machining object with a laser so that an optical axis extends along a surface direction in which the second region expands; and a machining procedure for displacing the optical axis of the laser in either one or both of a direction which intersects the surface formed by the second region and the surface direction in which the second region expands, so as to form a machining surface that is made into a new second region by the laser at the corner. As the machining object, a machining object in which at least a boundary region extending from the first region to the second region is masked by a material having a thermal conductivity of at least 1/20 of that of the machining object is used.
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Inventors:
ITOIGAWA FUMIHIRO (JP)
KONDA OSAMU (JP)
KONDA OSAMU (JP)
Application Number:
PCT/JP2021/007287
Publication Date:
September 01, 2022
Filing Date:
February 26, 2021
Export Citation:
Assignee:
NAGOYA INST TECH (JP)
International Classes:
B23K26/40; B23P15/28
Foreign References:
| JP2009066627A | 2009-04-02 | |||
| JP2018047503A | 2018-03-29 | |||
| JP2019042755A | 2019-03-22 | |||
| JP2010253654A | 2010-11-11 |
Attorney, Agent or Firm:
KT&S IP Firm, P.C. (JP)
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