LASER PROCESSING DEVICE, THICKNESS DETECTION METHOD, AND THICKNESS DETECTION DEVICE

WIPO Patent Application WO/2022/180775

A1

Provided is laser processing device that processes corner portions by, with respect to a laser for which the optical axis extends in a prescribed direction, relatively shifting an object to be processed, on which a coating layer made of a light-transmissive material, is formed at the corner portions, the laser processing device comprising: a displacement control means for controlling an actuator so that the object to be processed is relatively close to or away from the optical axis; a detection unit provided at least at a position outside the irradiation region extending in a tubular shape in the laser in a plan view intersecting the optical axis, and detecting the intensity of light reaching said position; and a detection means for detecting, as the thickness of the coating layer, the relative displacement distance of the object to be processed between the detected points of each of the first intensity and the third intensity when the detection unit detects, in order, a prescribed first intensity, a second intensity smaller than the first intensity, and a third intensity larger than the first intensity, in the process of the object to be processed relatively approaching or separating from the optical axis.

ITOIGAWA FUMIHIRO (JP)
KONDA OSAMU (JP)
FUJIWARA SHO (JP)
YASUDA SHOTARO (JP)

PCT/JP2021/007288

September 01, 2022

February 26, 2021

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NAGOYA INST TECH (JP)

B23K26/00; B23K26/40; B23P15/28; B23Q17/00

JP2018103338A	2018-07-05
JP2012091239A	2012-05-17
JP2020506065A	2020-02-27

KT&S IP Firm, P.C. (JP)

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