Title:
LASER MACHINING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/014504
Kind Code:
A1
Abstract:
Provided is a laser machining system that is able to carry out machining accurately even when a workpiece joint meanders. A laser machining system according to one embodiment of the present disclosure is provided with: a laser machining head having a laser optical system that has a Galvano scanner, and a tracking sensor for detecting a joint in a workpiece; a machining robot for positioning the laser machining head; a holding robot for holding the workpiece; a machining robot control unit for controlling the machining robot so as to move the laser machining head along a joint according to a design; a holding robot control unit for controlling the holding robot so as to move the workpiece such that the distance between the position of the joint as detected by the tracking sensor and the middle of the detection range of the tracking sensor remains within a prescribed range; and a Galvano scanner control unit for controlling the Galvano scanner so as to set the irradiation position of the laser light at a position that is offset by the movement amount of the workpiece from the position of the joint as detected by the tracking sensor.
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Inventors:
TANAKA TAKAHIRO (JP)
Application Number:
PCT/JP2021/026001
Publication Date:
January 20, 2022
Filing Date:
July 09, 2021
Export Citation:
Assignee:
FANUC CORP (JP)
International Classes:
B23K26/00; B23K26/08; B23K26/044
Foreign References:
| JP2019058942A | 2019-04-18 | |||
| JPH09141474A | 1997-06-03 | |||
| JPH0751869A | 1995-02-28 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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