Title:
LASER OPTICAL SYSTEM AND ADJUSTMENT METHOD THEREFOR, AND LASER MACHINING DEVICE AND METHOD
Document Type and Number:
WIPO Patent Application WO/2023/189715
Kind Code:
A1
Abstract:
Provided are: a laser optical system in which laser light can be adjusted so as to satisfy criteria for laser machining; an adjustment method for the laser optical system; and a laser machining device and method. Provided is a laser optical system (14) comprising a plurality of optical element units (U1–U3) arranged in series on an optical path of laser light. Each optical element unit includes a half-wave plate (WB1–WB3) and a Wollaston prism (WP1–WP3). Also provided is an adjustment method for a laser optical system in which laser light enters a Wollaston prism via a half-wave plate to branch into two branched laser light beams. Said method includes: a step in which the half-wave plate is rotated around an optical path to adjust the branching ratio of the branched laser light beams; and a step in which the Wollaston prism is rotated around the optical path to adjust the branching directions of the branched laser light beams.
Inventors:
AIKAWA CHIKARA (JP)
HAYASHI HIROKAZU (JP)
HAYASHI HIROKAZU (JP)
Application Number:
PCT/JP2023/010553
Publication Date:
October 05, 2023
Filing Date:
March 17, 2023
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD (JP)
International Classes:
B23K26/067; B23K26/00; B23K26/062; B23K26/064; B23K26/70
Foreign References:
| JP2015123499A | 2015-07-06 | |||
| JP2000011439A | 2000-01-14 | |||
| JPH0917003A | 1997-01-17 | |||
| JPH03116449A | 1991-05-17 | |||
| JPH07333558A | 1995-12-22 |
Attorney, Agent or Firm:
MATSUURA, Kenzo (JP)
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