LASER PIERCING METHOD AND MACHINING EQUIPMENT

Title:

LASER PIERCING METHOD AND MACHINING EQUIPMENT

Document Type and Number:

WIPO Patent Application WO/2006/132229

Kind Code:

A1

Abstract:

In processing equipment, a machining portion of a subject (W) to be machined is irradiated with a laser beam (L2), an assist gas (G) is jetted toward the machining portion from a nozzle (3) coaxially arranged with the laser beam (L2) to cover the machining portion with the assist gas (G), and a piercing hole (H) is machined at the machining portion. The machining equipment is provided with a control means (10) for machining the piercing hole (H) while shifting the nozzle (3) within a range from a machining start point to 5mm, after starting irradiation of the laser beams (L2).

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Inventors:

NUMATA SHINJI (JP)
SANO YOSHIMI (JP)

Application Number:

PCT/JP2006/311301

Publication Date:

December 14, 2006

Filing Date:

June 06, 2006

Export Citation:

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Assignee:

NISSAN TANAKA CORP (JP)
NUMATA SHINJI (JP)
SANO YOSHIMI (JP)

International Classes:

B23K26/38; B23K26/14; B23K103/04

Foreign References:

JPH06190582A	1994-07-12
JPH0716783A	1995-01-20
JP3292021B2	2002-06-17

Attorney, Agent or Firm:

Shiga, Masatake (Yaesu Chuo-ku, Tokyo 53, JP)

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