LASER PROCESSING APPARATUS, METHOD OF BONE JUNCTION, IMPLANT MEMBER, PROCESS FOR PRODUCING IMPLANT MEMBER, AND IMPLANT MEMBER PRODUCTION APPARATUS

Title:

LASER PROCESSING APPARATUS, METHOD OF BONE JUNCTION, IMPLANT MEMBER, PROCESS FOR PRODUCING IMPLANT MEMBER, AND IMPLANT MEMBER PRODUCTION APPARATUS

Document Type and Number:

WIPO Patent Application WO/2008/023708

Kind Code:

A1

Abstract:

A method of joining an implant member with a bone with ease within a short period of time. The method of bone junction for joining an implant member with a bone comprises the opening step of exposing bone (51) or implant member (52) to laser beams to thereby accomplish perforation processing of the bone (51) or implant member (52) to the junction position of bone (51) and implant member (52); and the junction step of exposing the junction position of bone (51) and implant member (52) through the hole made in the opening step to laser beams to thereby accomplish junction between the bone (51) and the implant member (52).

Inventors:

KANAOKA MASARU (JP)
OGITA TAIRA (JP)
MURAI TOORU (JP)
TADANO SHIGERU
TODOH MASAHIRO

Application Number:

PCT/JP2007/066203

Publication Date:

February 28, 2008

Filing Date:

August 21, 2007

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP (JP)
UNIV HOKKAIDO NAT UNIV CORP (JP)
KANAOKA MASARU (JP)
OGITA TAIRA (JP)
MURAI TOORU (JP)
TADANO SHIGERU
TODOH MASAHIRO

International Classes:

A61F2/46; A61B17/56; A61B17/88; A61B18/20; A61C8/00; A61C13/00; A61F2/28; A61L27/00; A61L27/12; B23K26/32; B23K26/40

Domestic Patent References:

WO2005047467A2

2005-05-26

Foreign References:

JP2000302622A	2000-10-31
JP2003126237A	2003-05-07
JP2003102755A	2003-04-08
JP2002301091A	2002-10-15
JPH0453550A	1992-02-21
JPH04300535A	1992-10-23
JPH02504478A	1990-12-20
JPS62502170A	1987-08-27
JP2003169845A	2003-06-17
US5071436A	1991-12-10
US5776193A	1998-07-07
US6187047B1	2001-02-13
JPH067425A	1994-01-18
JPS6452471A	1989-02-28

Other References: