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Title:
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/090905
Kind Code:
A1
Abstract:
This laser processing devices provided with a support unit, an irradiation unit, and a control unit. The irradiation unit has a forming unit which forms a laser beam such that, in a plane perpendicular to the optical axis of the laser beam, the shape of a part of the focus region has a longitudinal direction. The control unit comprises: a determining unit which determines the orientation of the longitudinal direction in the case of moving the part of the focus region relatively along a line, such that the longitudinal direction crosses the direction of movement of the part of the focus region; and an adjusting unit which, while the part of the focus region is moved relatively along the line, adjusts the orientation of the longitudinal direction so as to be the orientation determined by the determination unit.

Inventors:
SAKAMOTO TAKESHI (JP)
KOREMATSU KATSUHIRO (JP)
Application Number:
PCT/JP2019/042610
Publication Date:
May 07, 2020
Filing Date:
October 30, 2019
Export Citation:
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Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
B23K26/53; H01L21/301
Domestic Patent References:
WO2011030802A12011-03-17
Foreign References:
JP2018098464A2018-06-21
JP2006167804A2006-06-29
JP2017071074A2017-04-13
JP2015536896A2015-12-24
JP2017528322A2017-09-28
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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