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Title:
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/172020
Kind Code:
A1
Abstract:
A laser processing device (1A) is provided with: a semiconductor laser element (2); a waveform output unit (6) for outputting input waveform data (Da); a driver circuit (4) for supplying a drive current (id) having a time waveform corresponding to the input waveform data (Da) to the semiconductor laser element (2); and a processing optical system (5) for irradiating an object to be processed (B) with laser light output from the semiconductor laser element (2). The semiconductor laser element (2) outputs laser light (La) in which two or more light pulse groups including one or more light pulses are arranged at a time interval from each other. The time waveforms of at least two light pulse groups out of the two or more light pulse groups are different from each other. The time waveform includes at least one of each time waveform of the one or more light pulses, each time width of the one or more light pulses, and a time interval of the plurality of light pulses. As a result, a laser processing device and a laser processing method capable of downsizing the configuration in which an object to be processed is irradiated with a plurality of light pulses having different time waveforms at a time interval are achieved.

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Inventors:
KURITA TAKASHI (JP)
KAWAI KAZUKI (JP)
Application Number:
PCT/JP2021/005012
Publication Date:
September 02, 2021
Filing Date:
February 10, 2021
Export Citation:
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Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
B23K26/0622; H01S3/00; H01S5/062
Domestic Patent References:
WO2018110222A12018-06-21
WO2018105082A12018-06-14
WO2020059247A12020-03-26
Foreign References:
JP2015503856A2015-02-02
JP2010082672A2010-04-15
JP2017064747A2017-04-06
US20150336208A12015-11-26
JP2005511314A2005-04-28
JP2013128088A2013-06-27
Other References:
See also references of EP 4112220A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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