Title:
LASER PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/167021
Kind Code:
A1
Abstract:
The present invention provides a high-quality and high-output laser processing device suitable for manufacturing electrical components for automobiles and electronic components. A laser processing device 100 according to one embodiment of the present invention comprises: a wide-band light oscillation element 130 for generating a first light beam RB having a fundamental wavelength; a polarization plate 120 for controlling the oscillation direction of the first light beam RB; a narrow-band light oscillation control element 110 for narrowing the band of the first light beam RB; reflective mirrors 160 and 165 for reflecting this first light beam RB; a wavelength conversion unit 150 having a nonlinear crystal for extracting, from the reflected first light beam RB, a second light beam GB having a harmonic wavelength with respect to the fundamental wavelength; and an output mirror 170 that transmits only the wavelength-converted second light beam GB, and outputs output light 140 toward a workpiece.
Inventors:
NAKAYAMA SHINICHI (JP)
Application Number:
PCT/JP2021/006210
Publication Date:
August 26, 2021
Filing Date:
February 18, 2021
Export Citation:
Assignee:
EDGETECH CO LTD (JP)
International Classes:
B23K26/00; G02F1/37; H01S3/00; H01S3/109
Foreign References:
| JPH10135555A | 1998-05-22 | |||
| JP2000164958A | 2000-06-16 | |||
| JP2011176116A | 2011-09-08 | |||
| JP2005167117A | 2005-06-23 | |||
| JP2018508981A | 2018-03-29 | |||
| JP2011134735A | 2011-07-07 |
Attorney, Agent or Firm:
TOWA INTERNATIONAL PATENT FIRM (JP)
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