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Title:
LASER PROCESSING MACHINE, LASER PROCESSING METHOD, AND LASER PROCESSING PROGRAM
Document Type and Number:
WIPO Patent Application WO/2023/145334
Kind Code:
A1
Abstract:
This laser processing machine marks the surface of a workpiece with a matrix-type two-dimensional code in which first cells serving as unit irradiation areas and second cells serving as unit non-irradiation areas are arranged in a desired arrangement pattern in a first direction and a second direction orthogonal to the first direction, the laser processing machine comprising a laser processing head for irradiating a workpiece with laser light and a control unit for controlling the laser processing head; the control unit including a processing pattern selection unit; and the processing pattern selection unit selecting a provisional processing pattern from a plurality of processing patterns of the matrix-type two-dimensional code on the basis of selection conditions.

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Inventors:
HARUMIYA BUNYOU (JP)
Application Number:
PCT/JP2022/047450
Publication Date:
August 03, 2023
Filing Date:
December 22, 2022
Export Citation:
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Assignee:
AMADA CO LTD (JP)
International Classes:
B23K26/00; B23K26/14
Foreign References:
JP2008006466A2008-01-17
JP2017094388A2017-06-01
JP2009083249A2009-04-23
JP2021087997A2021-06-10
Attorney, Agent or Firm:
KISARAGI ASSOCIATES (JP)
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