Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
LASER PROCESSING MACHINE, LASER PROCESSING METHOD, AND LASER PROCESSING PROGRAM
Document Type and Number:
WIPO Patent Application WO/2023/145335
Kind Code:
A1
Abstract:
A laser processing machine and a laser processing method for marking the surface of a workpiece with a matrix-type two-dimensional code in which first cells serving as unit irradiation areas and second cells serving as unit non-irradiation areas are arranged in a desired arrangement pattern in a first direction and a second direction orthogonal to the first direction, wherein each of the first cells is irradiated with the laser light along both the first direction.

Inventors:
HARUMIYA BUNYOU (JP)
KAWAHARA CHIAKI (JP)
Application Number:
PCT/JP2022/047453
Publication Date:
August 03, 2023
Filing Date:
December 22, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
AMADA CO LTD (JP)
International Classes:
B23K26/00; B23K26/082
Foreign References:
JP2017094388A2017-06-01
JP2009083249A2009-04-23
JP2008006466A2008-01-17
JPH10175084A1998-06-30
JPH07185856A1995-07-25
Attorney, Agent or Firm:
KISARAGI ASSOCIATES (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: LASER PROCESSING MACHINE, LASER PROCESSING METHOD, AND LASER PROCESSING PROGRAM

Next Patent: LIGHTING SYSTEM CONTROL DEVICE