Title:
LASER PROCESSING METHOD AND LASER PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/073485
Kind Code:
A1
Abstract:
A laser processing method comprises: setting a processing path; controlling a light source (11) to emit an incident beam, and using a beam-splitting module (12) to split the incident beam into at least two laser beams; controlling the beam-splitting module to rotate, such that the at least two laser beams rotate about a given axis and together form a processing beam; and controlling the processing beam to move along the processing path to complete processing of a component to be processed. In the method, a beam-splitting module is used to split an incident beam into at least two laser beams, and then the beam-splitting module is caused to rotate, such that the at least two laser beams rotate and together form a processing beam that can be uniformly distributed spatially, thereby improving the quality of laser grooving, etching, cutting, and the like. Also disclosed is a laser processing apparatus.
Inventors:
YOU SHENGTIAN (CN)
Application Number:
PCT/CN2020/120536
Publication Date:
April 22, 2021
Filing Date:
October 13, 2020
Export Citation:
Assignee:
CHIPMORE TECH CORPORATION LIMITED (CN)
International Classes:
B23K26/067; B23K26/362
Foreign References:
| CN110539070A | 2019-12-06 | |||
| CN103286441A | 2013-09-11 | |||
| CN207534187U | 2018-06-26 | |||
| CN201702512U | 2011-01-12 | |||
| CN1644297A | 2005-07-27 | |||
| DE2937914A1 | 1980-03-27 |
Attorney, Agent or Firm:
SUZHOU WISPRO INTELLECTUAL PROPERTY AGENCY (CN)
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