Title:
LASER PROCESSING METHOD, SEMICONDUCTOR MEMBER MANUFACTURING METHOD, AND LASER PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/130054
Kind Code:
A1
Abstract:
JP19/049700
Provided is a laser processing method for cutting a semiconductor object along a virtual plane facing a semiconductor object surface inside the semiconductor object, the method comprising: a first step for forming a plurality of first modified spots along the virtual plane by irradiating the inside of the semiconductor object with a laser beam from the surface; and a second step for forming a plurality of second modified spots along the virtual plane so as not to overlap the plurality of first modified spots by irradiating the inside of the semiconductor object with a laser beam from the surface.
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Inventors:
TANAKA ATSUSHI (JP)
SASAOKA CHIAKI (JP)
AMANO HIROSHI (JP)
KAWAGUCHI DAISUKE (JP)
WANI YOTARO (JP)
IGASAKI YASUNORI (JP)
SASAOKA CHIAKI (JP)
AMANO HIROSHI (JP)
KAWAGUCHI DAISUKE (JP)
WANI YOTARO (JP)
IGASAKI YASUNORI (JP)
Application Number:
PCT/JP2019/049700
Publication Date:
June 25, 2020
Filing Date:
December 18, 2019
Export Citation:
Assignee:
NATIONAL UNIV CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM (JP)
HAMAMATSU PHOTONICS KK (JP)
HAMAMATSU PHOTONICS KK (JP)
International Classes:
B28D5/00; B23K26/53; H01L21/301; H01L21/304
Domestic Patent References:
| WO2017199784A1 | 2017-11-23 |
Foreign References:
| JP2004259846A | 2004-09-16 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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