Title:
LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/094025
Kind Code:
A1
Abstract:
A laser processing method, including: a first machining step in which a laser light, that forms a beam cross-section having a first shape and forms upon an object to be machined a first irradiation area (21) corresponding to the beam cross-section having the first shape, is sequentially irradiated over the entirety of an excavation area (24); and a second machining step in which a laser light, that forms a beam cross-section having a second shape smaller than the first shape and forms upon the object to be machined a second irradiation area (22) corresponding to the beam cross-section having the second shape, is sequentially irradiated on the excavation area (24). In the first machining step, the laser light forming the first irradiation area (21) is sequentially irradiated so as to form an overlapping area (23) wherein sections in the first irradiation area (21) overlap each other. In the second machining step, the laser light forming the second irradiation area (22) is sequentially irradiated such that the second irradiation area (22) is included in an area in the excavation area (24) other than the overlapping area (23).
Inventors:
MOTOKI YUTAKA (JP)
MORI TOSHIHIRO (JP)
MORI TOSHIHIRO (JP)
Application Number:
PCT/JP2011/079539
Publication Date:
June 27, 2013
Filing Date:
December 20, 2011
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
MOTOKI YUTAKA (JP)
MORI TOSHIHIRO (JP)
MOTOKI YUTAKA (JP)
MORI TOSHIHIRO (JP)
International Classes:
B23K26/38; B23K26/382; H05K3/00
Foreign References:
| JP2000263263A | 2000-09-26 | |||
| JP2007090438A | 2007-04-12 | |||
| JP2004314154A | 2004-11-11 |
Attorney, Agent or Firm:
SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)
Hiroaki Sakai (JP)
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Claims: