Title:
LASER TREATMENT METHOD, BONDING METHOD, COPPER MEMBER, METHOD FOR MANUFACTURING MULTILAYER PRINT WIRING SUBSTRATE, AND MULTILAYER PRINT WIRING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/021392
Kind Code:
A1
Abstract:
The present invention provides a laser treatment method including a step for surface-treating a copper surface by using laser, wherein a copper surface (11) is irradiated with a pulse laser (2) having a laser power that is near a threshold, at which the machining of a copper foil (10) is possible, and having a nano-order-second pulse width, in order to form a laser-wavelength-order periodic structure (12) on the copper surface (11), and also form a coating (13) on the copper surface (11). This enables the copper surface to be machined to exhibit favorable electrical characteristics and favorable adhesion to a resin material.
Inventors:
IWAMA MASAKI (JP)
MATSUSHITA SHUNICHI (JP)
MATSUSHITA SHUNICHI (JP)
Application Number:
PCT/JP2017/026996
Publication Date:
February 01, 2018
Filing Date:
July 26, 2017
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
B23K26/354; C23C26/00; H05K3/00; H05K3/38
Domestic Patent References:
| WO2004035255A1 | 2004-04-29 |
Foreign References:
| JP2005212013A | 2005-08-11 | |||
| JP2013242475A | 2013-12-05 | |||
| JPH06212451A | 1994-08-02 |
Other References:
See also references of EP 3492211A4
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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