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Patent Searching and Data


Title:
LATEX COMPOSITION FOR DIP MOLDING, MANUFACTURING METHOD THEREFOR, AND MOLDED ARTICLE THEREFROM
Document Type and Number:
WIPO Patent Application WO/2020/116793
Kind Code:
A1
Abstract:
The present invention relates to a latex composition for dip molding. More specifically, the present invention provides a latex composition for dip molding, a manufacturing method therefor, and a molded article manufactured therefrom, the latex composition for dip molding comprising a carbonic acid-modified nitrile-based copolymer latex and a hydrophobically modified, alkali-soluble emulsion thickener, wherein the hydrophobically modified, alkali-soluble emulsion thickener comprises a copolymer containing an assembly part and a non-assembly part. The assembly part comprises a monomer-derived repeating unit, the monomer having as a substituent at least one first hydrophobic group selected from the group consisting of: alkyl, alkenyl, perfluoroalkyl, and carboxylyl which each have 8 to 15 carbon atoms; and aryl, arylalkyl, arylalkenyl, alicyclic alkyl, and polycyclic alkyl which each have 6 to 15 carbon atoms.

Inventors:
KWON WON SANG (KR)
YEU SEUNG UK (KR)
OH SEUNG WHAN (KR)
JUNG YONG SEOK (KR)
HAN JUNG SU (KR)
Application Number:
PCT/KR2019/014709
Publication Date:
June 11, 2020
Filing Date:
November 01, 2019
Export Citation:
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Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C08L13/02; A41D19/00; C08J5/02; C08L9/04
Foreign References:
KR20100069621A2010-06-24
KR20120129936A2012-11-28
KR20010014590A2001-02-26
KR100379588B12003-07-18
JP2001520297A2001-10-30
Attorney, Agent or Firm:
P&P PATENT LAW FIRM (KR)
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