Title:
LAYERED BODY AND METHOD FOR PRODUCING LAYERED BODY
Document Type and Number:
WIPO Patent Application WO/2023/080182
Kind Code:
A1
Abstract:
The present invention relates to a layered body having, in order, a substrate, a molecular bonding layer, and a thin film, wherein the thickness of the thin film is 10 μm or less, and the substrate and the thin film are joined by chemical bonding via the molecular bonding layer.
Inventors:
MIZOBATA KAORI (JP)
SUZUKI TATSUYA (JP)
AKAMATSU KAORI (JP)
HONDA SATOSHI (JP)
ISHIGURO SHIGEKI (JP)
YAMAMOTO KENYA (JP)
SUZUKI TATSUYA (JP)
AKAMATSU KAORI (JP)
HONDA SATOSHI (JP)
ISHIGURO SHIGEKI (JP)
YAMAMOTO KENYA (JP)
Application Number:
PCT/JP2022/041093
Publication Date:
May 11, 2023
Filing Date:
November 02, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B7/12; B29C65/48; B32B15/08
Domestic Patent References:
| WO2022181380A1 | 2022-09-01 | |||
| WO2022172755A1 | 2022-08-18 |
Foreign References:
| JP2006054357A | 2006-02-23 | |||
| JP2019161054A | 2019-09-19 | |||
| JP2018126922A | 2018-08-16 | |||
| US20190198421A1 | 2019-06-27 | |||
| JP2013074193A | 2013-04-22 | |||
| JP2017013287A | 2017-01-19 | |||
| JP2022141112A | 2022-09-29 | |||
| US5368942A | 1994-11-29 | |||
| JP2017001119A | 2017-01-05 | |||
| JP2009098465A | 2009-05-07 | |||
| KR20200049085A | 2020-05-08 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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