Title:
MOLECULAR BONDING SHEET AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/080183
Kind Code:
A1
Abstract:
The present invention relates to a molecular bonding sheet comprising a base sheet and molecular bonding layers disposed on both surfaces of the base sheet, wherein the base sheet has a 23°C storage modulus G1 of 3.5×106-1.0×1010 Pa.
Inventors:
SUZUKI TATSUYA (JP)
AKAMATSU KAORI (JP)
MIZOBATA KAORI (JP)
HONDA SATOSHI (JP)
ISHIGURO SHIGEKI (JP)
AKAMATSU KAORI (JP)
MIZOBATA KAORI (JP)
HONDA SATOSHI (JP)
ISHIGURO SHIGEKI (JP)
Application Number:
PCT/JP2022/041094
Publication Date:
May 11, 2023
Filing Date:
November 02, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J7/35; B32B27/00; C09J7/22; C09J201/00
Domestic Patent References:
| WO2020026575A1 | 2020-02-06 | |||
| WO2018181517A1 | 2018-10-04 | |||
| WO2018181518A1 | 2018-10-04 | |||
| WO2019189667A1 | 2019-10-03 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
Download PDF:
Previous Patent: LAYERED BODY AND METHOD FOR PRODUCING LAYERED BODY
Next Patent: POLYESTER FIBER AND WOVEN FABRIC
Next Patent: POLYESTER FIBER AND WOVEN FABRIC