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Patent Searching and Data


Title:
LAYERED BODY FOR PACKAGING BAG, PACKAGING BAG, PACKAGING BAG WITH SPOUT, AND PACKAGING BAG WITH CONTENTS AND SPOUT
Document Type and Number:
WIPO Patent Application WO/2023/132361
Kind Code:
A1
Abstract:
This layered body for a packaging bag is used in a packaging bag, a packaging bag with a spout, and a packaging bag with contents and a spout. In this layered body for a packaging bag, a substrate layer (10), an intermediate layer (20), and a sealant layer (30) are layered in this order, the substrate layer (10) is an oriented film comprising a high-density polyethylene, the intermediate layer (20) is a multilayered co-extruded film in which support layers (22, 23) having polyethylene as the main component thereof are layered on both sides of a gas barrier resin layer (21), and the sealant layer (30) is a film that comprises one or more types of polymer selected from ethylene homopolymers or copolymers.

Inventors:
ICHIKAWA TORU (JP)
SHINOZAKI KOUSUKE (JP)
YOSHIKAWA KATSUYUKI (JP)
ITO MASAHIRO (JP)
NAGATA KENJI (JP)
TONG NAIJUN (JP)
Application Number:
PCT/JP2023/000166
Publication Date:
July 13, 2023
Filing Date:
January 06, 2023
Export Citation:
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Assignee:
HOSOKAWA YOKO KK (JP)
International Classes:
B32B27/32; B32B27/28; B65D30/02; B65D33/38; B65D65/40
Foreign References:
JPH11320739A1999-11-24
JP2017141061A2017-08-17
JP2019031318A2019-02-28
JP2011230798A2011-11-17
JP2020200062A2020-12-17
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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