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Patent Searching and Data


Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/132360
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a thermosetting resin composition that has high impregnation property for an insulating sheet and excellent mechanical properties without causing cracks after curing. The present invention relates to a thermosetting resin composition containing a glycidyl ether compound (a), a diluent (b) and at least one latent curing agent (c) selected from the group consisting of a boron trichloride amine complex, a boron trifluoride amine complex and zinc octylate, wherein, per 100 parts by mass of the glycidyl ether compound (a), the amount of the diluent (b) is 1 part by mass or more and less than 30 parts by mass and the amount of the latent curing agent (c) is 0.0005-5 parts by mass.

Inventors:
INOUE TOMOHIRO (JP)
Application Number:
PCT/JP2023/000158
Publication Date:
July 13, 2023
Filing Date:
January 06, 2023
Export Citation:
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Assignee:
NAGASE CHEMTEX CORP (JP)
International Classes:
C08G59/40; C08K3/38; C08K5/098; C08L63/00; H01B17/60
Domestic Patent References:
WO2014136657A12014-09-12
Foreign References:
JP2018168253A2018-11-01
JP2001261783A2001-09-26
JPH07278269A1995-10-24
JPH0649176A1994-02-22
JP2017016852A2017-01-19
JP2018512464A2018-05-17
JPS59223717A1984-12-15
JP2010535259A2010-11-18
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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