Title:
LEAD-FREE SN-AG-CU-NI-AL SYSTEM SOLDER ALLOY
Document Type and Number:
WIPO Patent Application WO/2007/014530
Kind Code:
A1
Abstract:
A lead-free Sn-Ag-Cu-Ni-Al system solder alloy which relates to the field of electronic materials and electronic manufacture technology, is composed of (in wt%): Ag 1.5~4.0, Cu 0.1~2.0, Al 0.001~0.5, Ni: 0.01~1.0, balance Sn and inevitable impurities. The lead-free solder alloy of the present invention could be produced by conventional manufacture methods to obtain various forms e.g. paste, powder, block, rod and thread etc, and further subjected to various welding processes e.g. reflow-soldering, wave-soldering and manual-welding etc to meet various demands. The solder alloy of the present invention has characteristics as follows: 1) spreading ratio of the solder alloy is improved; 2) the solder alloy is good in oxidation resistance and oxide-film could be removed using solvent during welding therefore welding joint has high bonding strength, homogeneous structure and little defection; 3) stability o the solder alloy is improved, and welding properties thereof would not deteriorate.
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Inventors:
MA JUSHENG (CN)
Application Number:
PCT/CN2006/001943
Publication Date:
February 08, 2007
Filing Date:
August 02, 2006
Export Citation:
Assignee:
MA JUSHENG (CN)
International Classes:
B23K35/26; C22C13/00
Foreign References:
| CN1718797A | 2006-01-11 | |||
| CN1775455A | 2006-05-24 | |||
| CN1262159A | 2000-08-09 | |||
| US5863493A | 1999-01-26 | |||
| CN1443626A | 2003-09-24 | |||
| JPH11129091A | 1999-05-18 |
Other References:
WANG W. ET AL.: "Effects of Addition Small Amount High Melting Point Metal on Properties of Lead-free Solders", ELECTRONIC COMPONENTS & MATERIALS, vol. 24, no. 9, September 2005 (2005-09-01), XP008076117
Attorney, Agent or Firm:
PANSINO INTELLECTUAL PROPERTY AGENT LTD (No. 13 Bei Er Tiao, Zhongguancu, Haidian District Beijing 0, CN)
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