Title:
A LOW MELTING POINT LEAD-FREE SOLDER ALLOY
Document Type and Number:
WIPO Patent Application WO/2007/014529
Kind Code:
A1
Abstract:
A low melting point lead-free solder alloy which relates to the field of electronic materials and electronic manufacture technology, is composed of (in wt%): Zn: 4~12, Ag: 0~2.5, Bi: 0.5~2.5, In: 0~5.0, P: 0.005~0.02, and balance Sn. The lead-free solder could be produced by casing using conventional method, i.e. weighing metal raw materials, heating in crucible or melting-pot under atmosphere, and stirring. The solder alloy produced by the method of the present invention has characteristics as follows: 1) the melting point of the solder alloy is reduced, which is generally below 200 ; 2) the difference between the solidus and liquidus thereof could be below 2 , thereby defection of weld separation could be avoided; 3) alloy structure is homogeneous, which improves the alloy strength; 4) spreading ratio of the solder alloy is similar to that of Pb-Sn eutectic alloy well-known; 5) the solder alloy could be formed to such as rod, thread and powder etc. easily.
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Inventors:
MA JUSHENG (CN)
Application Number:
PCT/CN2006/001942
Publication Date:
February 08, 2007
Filing Date:
August 02, 2006
Export Citation:
Assignee:
MA JUSHENG (CN)
International Classes:
B23K35/26; C22C13/00
Foreign References:
| JP2002113590A | 2002-04-16 | |||
| JP2004114124A | 2004-04-15 | |||
| JP2004034099A | 2004-02-05 | |||
| CN1439480A | 2003-09-03 | |||
| CN1198117A | 1998-11-04 | |||
| US6503338B1 | 2003-01-07 | |||
| CN1139607A | 1997-01-08 | |||
| CN1578713A | 2005-02-09 | |||
| JPH10249579A | 1998-09-22 |
Other References:
MA J. AND CHEN G.: "R&D of Lead-free Solder in Tsinghua University", ELECTRONIC COMPONENTS & MATERIALS, vol. 23, no. 11, November 2004 (2004-11-01), XP008076119
Attorney, Agent or Firm:
PANSINO INTELLECTUAL PROPERTY AGENT LTD (No. 13 Bei Er Tia, Zhongguancun Haidian District, CN)
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