LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER, AND LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER FOR AUTOMOBILE-MOUNTED ELECTRONIC MEMBER

Title:

LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER, AND LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER FOR AUTOMOBILE-MOUNTED ELECTRONIC MEMBER

Document Type and Number:

WIPO Patent Application WO/2007/102588

Kind Code:

A1

Abstract:

Disclosed is a lead-free solder alloy exhibiting good performance in impact resistance and vibration resistance. Also disclosed are a solder ball using such a lead-free solder alloy, and an electronic member having a solder bump using such a lead-free solder alloy. Specifically disclosed is a lead-free solder alloy characterized by consisting of 1.0-2.0% by mass of Ag, 0.3-1.0% by mass of Cu, 0.005-0.1% by mass of Ni and the balance of Sn and unavoidable impurities. In an Sn-Ag-Cu solder joint portion on a Cu electrode, a Cu3Sn intermetallic compound layer is formed directly on the Cu electrode and a Cu6Sn5 intermetallic compound layer is formed thereon. By substituting a Cu atom site in the Cu6Sn5 intermetallic compound layer with Ni having a smaller atomic radius than Cu, strain in the Cu6Sn5 intermetallic compound layer can be reduced, thereby improving impact resistance and vibration resistance in the solder joint portion.

Inventors:

TANAKA MASAMOTO (JP)
SASAKI TSUTOMU (JP)
KOBAYASHI TAKAYUKI (JP)
KAWAKAMI KAZUTO (JP)
FUJISHIMA MASAYOSHI (JP)

Application Number:

PCT/JP2007/054581

Publication Date:

September 13, 2007

Filing Date:

March 08, 2007

Export Citation:

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Assignee:

NIPPON STEEL MATERIALS CO LTD (JP)
NIPPON MICROMETAL CORP (JP)
TANAKA MASAMOTO (JP)
SASAKI TSUTOMU (JP)
KOBAYASHI TAKAYUKI (JP)
KAWAKAMI KAZUTO (JP)
FUJISHIMA MASAYOSHI (JP)

International Classes:

B23K35/26; C22C13/00; H05K3/34

Foreign References:

JP2001096394A	2001-04-10
JPH1177366A	1999-03-23
JPH11277290A	1999-10-12
JP2002239780A	2002-08-28
JP2003230980A	2003-08-19
JP2004141910A	2004-05-20
JP2005246480A	2005-09-15
JP2002246742A	2002-08-30
JP2003094195A	2003-04-02
JP2005153007A	2005-06-16

Attorney, Agent or Firm:

USHIKI, Mamoru (Yusei Fukushi Kotohira Bldg. 14-1, Toranomon 1-chome, Minato-k, Tokyo 01, JP)

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