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Patent Searching and Data


Title:
LED CHIP, LED, ARRAY AND LED ENCAPSULATION METHOD
Document Type and Number:
WIPO Patent Application WO/2021/046685
Kind Code:
A1
Abstract:
An LED chip, an LED, an LED array and an LED encapsulation method. A reflecting layer (114) is additionally arranged on the periphery of an LED, wherein the reflecting layer (114) adjusts the emission direction of light emitted by a light-emitting layer (113) of the LED, such that the adjusted emission direction is more concentrated in a certain direction needing illumination, preventing the light emitted by the light-emitting layer (113) from irradiating adjacent LEDs, and thereby causing interference in the adjacent LEDs, improving the light field directivity of emitted light beams. The present invention is easy to operate and convenient to implement, improves the performance of LEDs, and provides convenience for users in using an LED lamp.

Inventors:
CHEN CHING-CHUNG (CN)
Application Number:
PCT/CN2019/104947
Publication Date:
March 18, 2021
Filing Date:
September 09, 2019
Export Citation:
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Assignee:
CHONGQING KONKA PHOTOELECTRIC TECH RESEARCH INSTITUTE CO LTD (CN)
International Classes:
H01L33/46
Foreign References:
CN103904180A2014-07-02
CN208637452U2019-03-22
CN205692852U2016-11-16
CN107634129A2018-01-26
US6969874B12005-11-29
Attorney, Agent or Firm:
JOHNSON INTELLECTUAL PROPERTY AGENCY (SHENZHEN) (CN)
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