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Title:
LED CHIP TRANSFER METHOD AND DISPLAY PANEL
Document Type and Number:
WIPO Patent Application WO/2024/066430
Kind Code:
A1
Abstract:
An LED chip transfer method and a display panel. The chip transfer method comprises: providing a driving substrate (10) provided with at least one group of binding points, one group of binding points comprising a first binding point (101) and a second binding point (102); forming, on the driving substrate (10), a compensation layer (103) covering the first binding point (101) and the second binding point (102); providing a chip substrate, the chip substrate comprising a base substrate (201) and a plurality of chips (30); performing first alignment processing, and forming first recesses (103a) and second recesses (103b) on the compensation layer (103), the second recesses (103b) and the first recesses (103a) being spaced apart from each other; forming, on the compensation layer (103), first vias (103c) and second vias (103d) spaced apart from the first recesses (103a) and the second recesses (103b); forming, on the compensation layer (103), first transfer electrodes (401) and second transfer electrodes (402) disconnected from each other; inserting first pins (302) into the first recesses (103a) and binding the first pins (302) to the first transfer electrodes (401), and inserting second pins (303) into the second recesses (103b) and binding the second pins (303) to the second transfer electrodes (402); and peeling off the base substrate (201) from the chips (30).

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Inventors:
PU YANG (CN)
YUAN HAIJIANG (CN)
Application Number:
PCT/CN2023/097427
Publication Date:
April 04, 2024
Filing Date:
May 31, 2023
Export Citation:
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Assignee:
HKC CORP LTD (CN)
International Classes:
H01L33/62; H01L33/00; H01L33/48
Foreign References:
CN115295706A2022-11-04
CN110690247A2020-01-14
CN114823996A2022-07-29
CN114864439A2022-08-05
CN109786421A2019-05-21
CN111900154A2020-11-06
US20130134436A12013-05-30
Attorney, Agent or Firm:
SHENZHEN LIANDING INTELLECTUAL PROPERTY AGENT LTD. (CN)
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