Title:
LID BODY, ELECTRONIC COMPONENT ACCOMMODATION PACKAGE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/085378
Kind Code:
A1
Abstract:
The present invention is a lid body for an electronic component accommodation package, the lid body comprising: a conductor layer that has an opening part and a first part positioned surrounding the opening part; and a dielectric layer having a second part positioned inside the opening part, a first dielectric layer positioned on the conductor layer, and a second dielectric layer positioned below the conductor layer.
Inventors:
SHIRASAKI TAKAYUKI (JP)
Application Number:
PCT/JP2020/040105
Publication Date:
May 06, 2021
Filing Date:
October 26, 2020
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/00; H01L23/02; H01L23/06; H01L23/08
Domestic Patent References:
| WO2006059556A1 | 2006-06-08 |
Foreign References:
| JP2002231843A | 2002-08-16 | |||
| JP2017191835A | 2017-10-19 | |||
| JP2005051112A | 2005-02-24 | |||
| JP2008244475A | 2008-10-09 |
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
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