Title:
LIFT PIN, SEMICONDUCTOR MANUFACTURING APPARATUS, AND LIFT PIN MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/162928
Kind Code:
A1
Abstract:
Provided are a lift pin, a semiconductor manufacturing apparatus and a lift pin manufacturing method, wherein the lift pin has an ensured strength and does not affect boards. This lift pin 10, which is mounted on a lifting mechanism for lifting up a board W during the carrying of the board W in a semiconductor manufacturing apparatus and which is to support the board W, comprises: a first member 11 that abuts the board W during the lifting-up of the board W; and a second member 12 that is connected to the lifting mechanism. The lift pin 10 is characterized in that the first member 11 is lower in hardness than the board W, while the second member 12 is higher in strength than the first member 11.
Inventors:
MATSUMOTO MUNEYUKI (JP)
FUKUI HIROKAZU (JP)
FUKUI HIROKAZU (JP)
Application Number:
PCT/JP2021/003466
Publication Date:
August 04, 2022
Filing Date:
February 01, 2021
Export Citation:
Assignee:
AMAYA CO LTD (JP)
International Classes:
H01L21/683
Foreign References:
| US20190252229A1 | 2019-08-15 | |||
| JP2009059867A | 2009-03-19 | |||
| JPH0566989U | 1993-09-03 | |||
| CN203434136U | 2014-02-12 |
Attorney, Agent or Firm:
MAYAMA INTERNATIONAL PATENT OFFICE (JP)
Download PDF: