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Title:
LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/024369
Kind Code:
A1
Abstract:
[Problem] To provide: a light-emitting device configured such that a substrate that has been singulated can be suitably protected; and a manufacturing method for the same. [Solution] A light-emitting device according to this present disclosure comprises: a substrate; a light-emitting element provided to a first surface of the substrate; a lens provided to a second surface of the substrate; and a film provided to a third surface, which is located between the first surface and the second surface of the substrate.

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Inventors:
ONO SHOGO (JP)
Application Number:
PCT/JP2023/023708
Publication Date:
February 01, 2024
Filing Date:
June 27, 2023
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01S5/026; H01S5/028
Domestic Patent References:
WO2021145238A12021-07-22
WO2021149373A12021-07-29
WO2022107571A12022-05-27
Foreign References:
JP2011146633A2011-07-28
JPH09102473A1997-04-15
JP2017041488A2017-02-23
JP2020155771A2020-09-24
US4935939A1990-06-19
Attorney, Agent or Firm:
MIYAJIMA Manabu (JP)
Download PDF:
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