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Title:
LIGHT-SENSITIVE RESIN COMPOSITION, DRY FILM, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2016/121395
Kind Code:
A1
Abstract:
A light-sensitive resin composition contains a carboxyl-group-containing resin (A), an unsaturated compound (B), a photopolymerization initiator (C), an epoxy compound (D), and a component (E) containing at least one compound selected from the group comprising melamine and melamine derivatives. The carboxyl-group-containing resin (A) contains a carboxyl-group-containing resin (A1) having a bisphenol fluorene skeleton.

Inventors:
HIGUCHI MICHIYA (JP)
HASHIMOTO SOICHI (JP)
MARUSAWA HISASHI (JP)
TANAKA SHINYA (JP)
ARAI TAKASHI (JP)
KAWASATO HIRONOBU (JP)
INABA SHINJI (JP)
Application Number:
PCT/JP2016/000428
Publication Date:
August 04, 2016
Filing Date:
January 28, 2016
Export Citation:
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Assignee:
GOO CHEMICAL CO LTD (JP)
NIPPON STEEL & SUMIKIN CHEM CO (JP)
International Classes:
G03F7/027; C08G59/14; C08G59/42; G03F7/004; G03F7/029; G03F7/031; H05K1/03; H05K3/46
Domestic Patent References:
WO2013172009A12013-11-21
WO2013021734A12013-02-14
Foreign References:
JP2006096962A2006-04-13
JP2001131242A2001-05-15
JP2001131241A2001-05-15
JP2005189841A2005-07-14
JP2015011256A2015-01-19
Attorney, Agent or Firm:
NISHIKAWA, Yoshikiyo et al. (JP)
Yoshikiyo Nishikawa (JP)
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