Title:
LIGHT SOURCE APPARATUS
Document Type and Number:
WIPO Patent Application WO/2014/054523
Kind Code:
A1
Abstract:
A light source apparatus provided with a substrate on which a light semiconductor element is mounted, a heat-dissipating member for supporting the substrate, and a heat-conductive pressure-sensitive adhesive sheet provided on the heat-dissipating member. Heat conduction of the heat-conductive pressure-sensitive adhesive sheet is at least 0.5 W/m·K, and after the heat-conductive pressure-sensitive adhesive sheet is affixed to an aluminum plate at 25°C, the 180° separation adhesion force when separated from the aluminum plate at 180° at a speed of 300 mm/minute is at least 0.1 N/20 mm.
Inventors:
FURUTA KENJI (JP)
Application Number:
PCT/JP2013/076240
Publication Date:
April 10, 2014
Filing Date:
September 27, 2013
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L33/64; C09J11/04; C09J133/00; F21S2/00; F21V29/00; F21Y101/02
Domestic Patent References:
| WO2008093440A1 | 2008-08-07 |
Foreign References:
| JP2011529526A | 2011-12-08 | |||
| JP2003221573A | 2003-08-08 | |||
| JP2012180495A | 2012-09-20 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Hiroyuki Okamoto (JP)
Hiroyuki Okamoto (JP)
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