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Title:
LIQUID CRYSTAL POLYMER PARTICLES, THERMOSETTING RESIN COMPOSITION, AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2022/113942
Kind Code:
A1
Abstract:
[Problem] To provide liquid crystal polymer particles with which, when added to a resin film, the dielectric loss tangent can be reduced while suppressing an increase in the surface roughness and linear expansion coefficient of the resin film. [Solution] At least 80 mass% of particles with respect to the total amount of liquid crystal polymer particles according to the present invention have flat shapes, and the flat liquid crystal polymer particles are characterized in that the major diameter, minor diameter, and thickness defined as below satisfy the following conditions (A) and (B): (A) the elongation, which is the ratio of the major diameter and the minor diameter, is 1.2-5.0; and (B) the flatness, which is the ratio of the minor diameter and the thickness, is at least 1.2.

Inventors:
EGASHIRA TOSHIAKI (JP)
MURAKAMI HIROAKI (JP)
Application Number:
PCT/JP2021/042826
Publication Date:
June 02, 2022
Filing Date:
November 22, 2021
Export Citation:
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Assignee:
ENEOS CORP (JP)
International Classes:
C08J3/12; C08G63/60; C08J5/18; C08L101/00; C08L101/12
Domestic Patent References:
WO2017150336A12017-09-08
Foreign References:
JP2015530460A2015-10-15
JP2007262334A2007-10-11
JP2001131406A2001-05-15
JP6295013B22018-03-14
JP2019001866A2019-01-10
JP2005501760A2005-01-20
JP5904307B22016-04-13
JP6697644B12020-05-20
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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