Title:
LIQUID EPOXY RESIN COMPOSITION AND EPOXY RESIN CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2008/035515
Kind Code:
A1
Abstract:
Disclosed is a liquid epoxy resin composition having high curing rate and excellent viscosity lowering effect, wherein physical properties of an epoxy resin serving as the base do not deteriorate much. The liquid epoxy resin composition is characterized by containing the following components (A), (B) and (C). (A) an epoxy resin (B) an α-vinyloxy-ω-glycidylether compound represented by the following general formula (1): CH2=CH-O-X-O-G (1) (In the formula, X represents a divalent linear or branched alkylene group having 2-12 carbon atoms or an alicyclic alkylene group containing a cyclohexylene group; and G represents a glycidyl group.) (C) a curing agent
Inventors:
KAMADA AMI (JP)
HABA KAZUHIKO (JP)
HABA KAZUHIKO (JP)
Application Number:
PCT/JP2007/065693
Publication Date:
March 27, 2008
Filing Date:
August 10, 2007
Export Citation:
Assignee:
MARUZEN PETROCHEM CO LTD (JP)
KAMADA AMI (JP)
HABA KAZUHIKO (JP)
KAMADA AMI (JP)
HABA KAZUHIKO (JP)
International Classes:
C08G59/24
Domestic Patent References:
| WO2003051955A1 | 2003-06-26 |
Foreign References:
| JP2006016448A | 2006-01-19 | |||
| JPH09151303A | 1997-06-10 | |||
| JP2003026766A | 2003-01-29 | |||
| JP2006241081A | 2006-09-14 |
Attorney, Agent or Firm:
ONO, Nobuo (1-13-1 Kandaizumi-ch, Chiyoda-ku Tokyo 24, JP)
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