Title:
LIQUID METAL CONDUCTIVE SLURRY AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/121278
Kind Code:
A1
Abstract:
A liquid metal conductive slurry and an electronic device, relating to the technical field of new materials. The liquid metal conductive slurry comprises, in percentages by weight, 1-50% of liquid metal microcapsules, 30-80% of conductive powder, 1-25% of base polymer and 10-40% of solvent by weight, the capsule wall of the liquid metal microcapsule being a coating polymer, the capsule core thereof being a liquid metal, and the melting point of the liquid metal satisfying: the liquid metal being in a liquid state when a conductive circuit made of the liquid metal conductive slurry is deformed. The liquid metal conductive slurry enables the conductive circuit to have good flexibility.
Inventors:
LI PING (CN)
DONG SHIJIN (CN)
MEN ZHENLONG (CN)
DONG SHIJIN (CN)
MEN ZHENLONG (CN)
Application Number:
PCT/CN2020/136874
Publication Date:
June 24, 2021
Filing Date:
December 16, 2020
Export Citation:
Assignee:
BEIJING DREAM INK TECH CO LTD (CN)
International Classes:
B22F1/02; H01B1/22; H01B13/00
Foreign References:
CN105609163A | 2016-05-25 | |||
CN110729071A | 2020-01-24 | |||
CN109627829A | 2019-04-16 | |||
CN109570515A | 2019-04-05 | |||
CN104700924A | 2015-06-10 | |||
US20140264191A1 | 2014-09-18 |
Other References:
ANONYMOUS: "Metal also has a "regeneration" function", 25 October 2013 (2013-10-25), pages 1 - 2, XP055821970, Retrieved from the Internet
Attorney, Agent or Firm:
UNI-INTEL PATENT AND TRADEMARK LAW FIRM (CN)
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