Title:
LIQUID RESIN COMPOSITION AND CURED OBJECT OBTAINED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2022/085522
Kind Code:
A1
Abstract:
Provided is a liquid resin composition which retains low-warpage characteristics and is excellent in terms of heat resistance, chemical resistance, and the property of wetting heat-resistant insulating coats. The liquid resin composition comprises epoxy resins, a hardener, and a ceramic filler. The epoxy resins comprise a first epoxy resin and a second epoxy resin. The first epoxy resin has a poly(alkylene glycol) skeleton. The second epoxy resin has an aromatic ring and three or more epoxy groups in the molecule. The hardener comprises a compound having two or more phenolic hydroxyl groups in the molecule. The proportion of the first epoxy resin in the epoxy resins is 10-25 mass%.
Inventors:
KONISHI TAKANORI
ISHIGAKI MASAKI
DOI GENTA
ISHIGAKI MASAKI
DOI GENTA
Application Number:
PCT/JP2021/037787
Publication Date:
April 28, 2022
Filing Date:
October 12, 2021
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08G59/38; C08G59/62; C08K3/013; C08L63/00
Domestic Patent References:
| WO2015146149A1 | 2015-10-01 | |||
| WO2017191801A1 | 2017-11-09 | |||
| WO2018221682A1 | 2018-12-06 | |||
| WO2018221681A1 | 2018-12-06 |
Foreign References:
| JP2010126702A | 2010-06-10 | |||
| JP2011168634A | 2011-09-01 | |||
| JPH09268221A | 1997-10-14 | |||
| JP2007138002A | 2007-06-07 | |||
| JP2007284467A | 2007-11-01 | |||
| JP2007284474A | 2007-11-01 | |||
| JPH04173833A | 1992-06-22 | |||
| US20200088937A1 | 2020-03-19 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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