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Patent Searching and Data


Title:
LIQUID SUPPLY DEVICE AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/185467
Kind Code:
A1
Abstract:
 Provided is a liquid supply device for supplying a processing liquid to a processing device, and recovering and resupplying the processing liquid, wherein the liquid supply device is provided with: a plurality of supply tanks for containing the processing liquid, the supply tanks having an exhaust path and an overflow line and being capable of switching between supply mode for supplying the processing liquid and standby mode for standing by while containing the processing liquid; a supply mechanism for supplying the processing liquid to the processing device from the supply tank, from among the plurality of supply tanks, that is in supply mode; a recovery mechanism for recovering the surplus processing liquid in the processing device and returning the recovered processing liquid to the supply tank that is in supply mode; and opening/closing mechanisms provided to each of the supply tanks, each of the opening/closing mechanisms blocking the exhaust path and the overflow line. It is thereby possible to extend the lifespan of the processing liquid contained in the supply tanks in standby state.

Inventors:
HAYASHI KONOSUKE (JP)
OOTAGAKI TAKASHI (JP)
MATSUI EMI (JP)
Application Number:
PCT/JP2014/062878
Publication Date:
November 20, 2014
Filing Date:
May 14, 2014
Export Citation:
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Assignee:
SHIBAURA MECHATRONICS CORP (JP)
International Classes:
H01L21/306; H01L21/027; H01L21/304
Foreign References:
JPH11165116A1999-06-22
JP2003297795A2003-10-17
JPH11147035A1999-06-02
JPH062347A1994-01-11
JP2007319948A2007-12-13
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
Masatoshi Kurata (JP)
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