Title:
LOUDSPEAKER MODULE
Document Type and Number:
WIPO Patent Application WO/2020/098101
Kind Code:
A1
Abstract:
Disclosed in the present invention is a loudspeaker module, comprising a module central housing and a static electricity-removing structure; the static electricity-removing structure comprises a conductive plastic member, a metal insert connected to the conductive plastic member, a conductive steel sheet and a fixing component; a protruding part is arranged on an outer side wall of the module central housing; the metal insert and the fixing component are injection molded onto the protruding part; one end of the conductive steel sheet is connected to the metal insert, and the other end is connected to a first position of an external device; the conductive plastic member is fixed onto the protruding part by means of a secondary injection molding mode; and the metal insert is conductively connected to the fixing component by means of the conductive plastic member. The present speaker module is arranged at a second position of the external device by means of the fixing component.
Inventors:
LI CHENGWEI (CN)
CHEN MENG (CN)
LI ZHENJUN (CN)
CHEN MENG (CN)
LI ZHENJUN (CN)
Application Number:
PCT/CN2018/124432
Publication Date:
May 22, 2020
Filing Date:
December 27, 2018
Export Citation:
Assignee:
GOERTEK INC (CN)
International Classes:
H04R9/06
Foreign References:
CN207475806U | 2018-06-08 | |||
CN1794903A | 2006-06-28 | |||
CN205670827U | 2016-11-02 | |||
CN102523550A | 2012-06-27 | |||
US20110216911A1 | 2011-09-08 |
Download PDF:
Previous Patent: METHOD AND APPARATUS FOR ALLOCATING RESOURCES ON BASIS OF DATA ANALYSIS, AND COMPUTER DEVICE
Next Patent: LOUDSPEAKER MODULE
Next Patent: LOUDSPEAKER MODULE