LOW DIELECTRIC LOSS RESIN COMPOSITION, METHOD FOR PRODUCING SAME, MOLDED BODY FOR HIGH FREQUENCY DEVICES, AND HIGH FREQUENCY DEVICE

WIPO Patent Application WO/2022/254960

A1

[Problem] To provide: a novel low dielectric loss resin composition which has a low coefficient of loss in a high frequency band, while being excellent in terms of low dielectric loss characteristics; a method for producing this low dielectric loss resin composition; a molded body for high frequency devices; and a high frequency device. [Solution] A low dielectric loss resin composition according to the present invention contains at least a polymer resin and an inorganic filler, and is characterized in that the inorganic filler contains at least one substance that is selected from the group consisting of BiF3, ZrF4, HfF4, CeF3 and K2SiF6. This low dielectric loss resin composition is applicable to a molded body for high frequency devices that are used in a frequency band of 1 GHz or more, and to a high frequency device that is used in a frequency band of 1 GHz or more.

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OONO TAKASHI (JP)
FUJIWARA KEIGO (JP)
SATO TOMOYA (JP)
YAMAMOTO MASASHI (JP)
NII KEIICHI (JP)
NISHIDA TETSUO (JP)

PCT/JP2022/016926

December 08, 2022

March 31, 2022

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STELLA CHEMIFA CORP (JP)

C08L101/00; C08K3/013; C08K3/16; C08K3/34; H05K1/03

JP2010096616A	2010-04-30
JP2017059522A	2017-03-23
JP2010534274A	2010-11-04
JPH07324142A	1995-12-12
JPH07290367A	1995-11-07
JPS5388856A	1978-08-04
JP2003342478A	2003-12-03

KOYAMA Yasushi (JP)

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