LOW-DIELECTRIC SUBSTRATE MATERIAL

WIPO Patent Application WO/2022/224899

A1

A low-dielectric substrate material (1) comprises a metal layer (2) and a porous resin layer (3) disposed on one surface, along the thickness direction, of the metal layer (2). The porous resin layer (3) can be equally divided in the thickness direction into four portions, which are a first region (31), a second region (32), a third region (33), and a fourth region (34) that are located in this order along the receding direction from the metal layer (2). The first region (31) has, in a resin matrix (35), a plurality of closed cells (30) independent of each other, and the plurality of closed cells (30) in the first region (31) have an average aspect ratio AR of 0.80-1.20. The average aspect ratio AR is the ratio (L1/L2), in a cross-sectional view, of the length L1 of the closed cell (30) in a direction orthogonal to the thickness direction to the length L2 of the closed cell (30) in the thickness direction.

JP2573732	[Name of device] Decorative sheet with excellent unevenness expression
WO/2019/145548	FLEXIBLE, SOUND-ABSORBING DEVICE

IMAIZUMI TAKU (JP)
MATSUTOMI AKIHITO (JP)
NAGAMI NAOTO (JP)

PCT/JP2022/017795

October 27, 2022

April 14, 2022

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NITTO DENKO CORP (JP)

B32B5/18; C08J9/26; B32B5/22; B32B5/24; B32B7/022; B32B15/08; B32B27/08; C08G73/10; H01Q1/38; H05K1/03

WO2020066146A1	2020-04-02
WO2018186486A1	2018-10-11
WO2016159060A1	2016-10-06

JP2018021172A	2018-02-08
JP2020049897A	2020-04-02
JP2001270034A	2001-10-02
JP2014132057A	2014-07-17
US20070003773A1	2007-01-04
US20170241604A1	2017-08-24

OKAMOTO, Hiroyuki et al. (JP)

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