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Title:
ADHESIVE RESIN FILM AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/224900
Kind Code:
A1
Abstract:
This adhesive resin film is provided with a base material layer, a concavo-convex absorptive resin layer, and an adhesive resin layer in this order, and is used to protect a circuit forming surface of an electronic component. The concavo-convex absorptive resin layer has a minimum value G'bmin of a storage elastic modulus G'b of 0.001 MPa or more and less than 0.1 MPa at 25°C or more and less than 250°C and has a storage elastic modulus G'b250 of 0.005 MPa to 0.3 MPa, inclusive, at 250°C.

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Inventors:
UNEZAKI TAKASHI (JP)
KAI TAKASHI (JP)
MUROFUSHI TAKANOBU (JP)
KINOSHITA JIN (JP)
Application Number:
PCT/JP2022/017801
Publication Date:
October 27, 2022
Filing Date:
April 14, 2022
Export Citation:
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Assignee:
MITSUI CHEMICALS TOHCELLO INC (JP)
International Classes:
B32B27/00; C09J7/29; C09J201/00; H01L21/304; H01L21/683
Domestic Patent References:
WO2019017226A12019-01-24
WO2020059572A12020-03-26
WO2020203089A12020-10-08
WO2021235389A12021-11-25
Foreign References:
JP6404475B22018-10-10
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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