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Title:
LOW-TEMPERATURE EASY-BONDING TPU HOT MELT ADHESIVE FILM AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/221229
Kind Code:
A1
Abstract:
The present invention relates to the field of TPU hot melt adhesive films. The present invention particularly relates to a low-temperature easy-bonding TPU hot melt adhesive film, comprising the following raw materials in parts by weight: 70-95 parts of a thermoplastic polyurethane solution, 45-60 parts of a polyol, 13-20 parts of a polyisocyanate, 15-20 parts of a dihydroxyalkyl polydimethylsiloxane, 12-15 parts of a tackifier, 7-14 parts of a functional additive, and 2-4 parts of an antioxidant. The present invention provides the low-temperature easy-bonding TPU hot melt adhesive film and a preparation method therefor.

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Inventors:
BIN JIAQUAN (CN)
BIN JIAQI (CN)
Application Number:
PCT/CN2022/099953
Publication Date:
November 23, 2023
Filing Date:
June 20, 2022
Export Citation:
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Assignee:
GUANG DONG GEN Q NEW MAT CO LTD (CN)
International Classes:
C08G18/44; C09J175/04; C08G18/48; C08G18/61; C09J7/10; C09J7/35; C09J11/06; C09J11/08
Foreign References:
CN109266290A2019-01-25
CN112210336A2021-01-12
CN111019586A2020-04-17
CN106433540A2017-02-22
CN112724653A2021-04-30
CN109837024A2019-06-04
CN112322248A2021-02-05
CN102051152A2011-05-11
US20110245449A12011-10-06
EP2944660A12015-11-18
JP2004035799A2004-02-05
Attorney, Agent or Firm:
DONGGUAN HENGCHENG IP AGENCY CO., LTD. (CN)
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