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Title:
LOW-TEMPERATURE-RESISTANT FLEXIBLE PHOTOSENSITIVE RESIN COMPOSITION FOR PHOTOCURING 3D PRINTING AND PREPARATION METHOD FOR LOW-TEMPERATURE-RESISTANT FLEXIBLE PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/050530
Kind Code:
A1
Abstract:
Disclosed are a low-temperature-resistant flexible photosensitive resin composition for photocuring 3D printing and a preparation method for the low-temperature-resistant flexible photosensitive resin composition. The composition comprises the following raw materials in parts by weight: 5-40 parts of a silicon-containing chain polyurethane prepolymer end-capped with an acrylic acid group, 20-60 parts of a flexible polyurethane prepolymer end-capped with an acrylic acid group, 5-10 parts of a polyurethane acrylate resin, 20-70 parts of a reactive diluent, 1.0-5.0 parts of a photoinitiator, and 0.1-1.0 part of an antioxidant. The low-temperature-resistant flexible photosensitive resin composition for photocuring 3D printing has high reactivity and can be used for conventional SLA, DLP and other desktop-level 3D printing devices. Moreover, the printed product contains a silicon chain, has good low temperature resistance, a small shrinkage rate, is not prone to yellowing, and has excellent mechanical properties.

Inventors:
CHEN SHAOYUN (CN)
ZHUO DONGXIAN (CN)
LUO YONGQIANG (CN)
HUANG HUILING (CN)
QU BO (CN)
WANG RUI (CN)
ZHENG YANYU (CN)
LIU XIAOYING (CN)
LI WENJIE (CN)
CHEN MIAOMIAO (CN)
XU YIHAO (CN)
Application Number:
PCT/CN2021/128718
Publication Date:
April 06, 2023
Filing Date:
November 04, 2021
Export Citation:
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Assignee:
UNIV QUANZHOU NORMAL (CN)
International Classes:
C08F283/02; B33Y70/00; C08F2/48; C08F283/00; C08F283/06; C08F283/12
Foreign References:
CN113105606A2021-07-13
CN113105590A2021-07-13
CN109777024A2019-05-21
KR20170128955A2017-11-24
KR20190001794A2019-01-07
CN108047386A2018-05-18
Attorney, Agent or Firm:
FUZHOU JUNCHENG ZHISHICHANQUAN DAILI YOUXIANGONGSI (CN)
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